High thermal conductivity of boron nitride filled epoxy composites prepared by tin solder nanoparticle decoration
Eunsung Lee, Jong-Gu Kang, Min-Kyeong Kang, Ki‐Hong Kim, Seontae Park, Yong Su Kim, In Kim, Sung‐Dug Kim, Jin‐Young Bae
Topics & Concepts
Materials scienceEpoxyComposite materialThermal conductivityBoron nitrideComposite numberCuring (chemistry)NanoparticleTinPolymerDielectricNanotechnologyMetallurgyOptoelectronicsThermal properties of materialsDielectric materials and actuatorsThermal Radiation and Cooling Technologies