High temperature aging of epoxy-based molding compound and its effect on mechanical behavior of molded electronic package
Adwait Inamdar, Yu-Hsiang Yang, Alexandru Prisacaru, Przemyslaw Jakub Gromala, Bongtae Han
Topics & Concepts
Materials scienceComposite materialEpoxyMolding (decorative)MicroelectronicsElectronic packagingThermal expansionContext (archaeology)Glass transitionDynamic mechanical analysisTemperature cyclingPolymerThermalNanotechnologyPaleontologyBiologyMeteorologyPhysicsElectronic Packaging and Soldering TechnologiesMechanical Behavior of Composites3D IC and TSV technologies