Improving accuracy of filling performance prediction in microvia copper electroplating
Jeong-Ho Moon, Jaewook Shin, Tae‐Hee Kim, Donghoon Song, EunAe Cho
Topics & Concepts
ElectroplatingChemistryPlating (geology)Cathodic protectionCopper platingPEG ratioLinear sweep voltammetryCopperElectrochemistryCyclic voltammetryPolyethylene glycolElectrolyteCathodic stripping voltammetryChemical engineeringElectrodeMetallurgyAnalytical Chemistry (journal)Materials scienceChromatographyLayer (electronics)Organic chemistryPhysical chemistryEconomicsFinanceEngineeringGeologyGeophysicsElectrodeposition and Electroless CoatingsElectronic Packaging and Soldering TechnologiesNanomaterials and Printing Technologies