A novel packaging method for FBG temperature sensors based on ultrasonic-assisted soldering technology
Yang Xue-li, Mingyao Liu, Han Song, Jun Rao, Yihang Wu
Topics & Concepts
SolderingMaterials scienceComposite materialWeldingUltrasonic sensorThermal expansionCapillary actionUltrasonic weldingResidual stressFiber Bragg gratingAdhesiveOptoelectronicsAcousticsLayer (electronics)PhysicsWavelengthAdvanced Fiber Optic SensorsPhotonic and Optical DevicesSemiconductor Lasers and Optical Devices