Effect and mechanism analysis of sarcosine on the chemical mechanical polishing performance of copper film for GLSI
Yinchan Zhang, Xinhuan Niu, Jiakai Zhou, Jianchao Wang, Yebo Zhu, Ziyang Hou, Han Yan, Fu Luo, Minghui Qu
Topics & Concepts
Chemical-mechanical planarizationMaterials sciencePolishingWaferX-ray photoelectron spectroscopyCopper interconnectCopperScanning electron microscopeChemical engineeringReagentIsotropic etchingAdsorptionEtching (microfabrication)NanotechnologyComposite materialMetallurgyChemistryLayer (electronics)Organic chemistryEngineeringAdvanced Surface Polishing TechniquesIntegrated Circuits and Semiconductor Failure AnalysisAdvanced materials and composites