Low temperature curing polyimides with covalent-boned 5-aminobenzimidazole
Yuying Sui, Jinhui Li, Tao Wang, Deliang Sun, Chao Huang, Fan Zhang, Liang Shan, Fangfang Niu, Guoping Zhang, Rong Sun
Topics & Concepts
PolyimideMaterials scienceGlass transitionCuring (chemistry)Composite materialUltimate tensile strengthThermal stabilityDielectricCovalent bondWaferElongationPolymerOptoelectronicsChemical engineeringChemistryLayer (electronics)EngineeringOrganic chemistrySynthesis and properties of polymersEpoxy Resin Curing ProcessesAdvanced Sensor and Energy Harvesting Materials