Study on the subsurface damage depth of monocrystalline silicon in ultrasonic vibration assisted diamond wire sawing
Yan Wang, Bocheng Zhao, Shengju Huang, Zhaofeng Qian
Topics & Concepts
Monocrystalline siliconMaterials scienceWaferDiamondVibrationUltrasonic sensorSiliconSlicingFinite element methodComposite materialStructural engineeringAcousticsOptoelectronicsMechanical engineeringEngineeringPhysicsAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationAdvanced Machining and Optimization Techniques