The influence of leveler Brilliant Green on copper superconformal electroplating based on electrochemical and theoretical study
Yaqiang Li, Penghui Ren, Yuanhang Zhang, Shengxu Wang, Jinqiu Zhang, Peixia Yang, Anmin Liu, Guangzhao Wang, Zhidong Chen, Maozhong An
Topics & Concepts
CopperElectroplatingElectrochemistryChemical engineeringMaterials scienceChemistryNanotechnologyMetallurgyEngineeringPhysical chemistryElectrodeLayer (electronics)Electrodeposition and Electroless CoatingsElectronic Packaging and Soldering TechnologiesCorrosion Behavior and Inhibition