Crack propagation mechanisms in laser slicing of 4° off-axis 4H-SiC and separation strength regulation via multi-beam processing
Heng Wang, Qiang Cao, Tianhao Wu, Lulu Yu, Zhenzhong Wang, Sheng Peng, Du Wang, Sheng Peng, Du Wang
Topics & Concepts
Materials scienceSlicingWaferComposite materialLaserUltimate tensile strengthGrindingAnisotropyUltrasonic sensorFracture mechanicsGraphiteSiliconLayer (electronics)Cleavage (geology)ThermalSilicon carbideDiamondPosition (finance)Laser cuttingOpticsAmorphous solidDamage toleranceAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchIntegrated Circuits and Semiconductor Failure Analysis