Optimizing thermal performance in high-power-density 3D integrated circuits through advanced microchannel structures and multi-layer cooling
Wenlu Niu, Wei He, Jiaqi Li, Qiang Li
Topics & Concepts
MicrochannelMaterials sciencePower densityThermalThree-dimensional integrated circuitPower (physics)Electronic circuitComputer coolingThermal management of electronic devices and systemsIntegrated circuitEngineering physicsLayer (electronics)Mechanical engineeringElectrical engineeringNuclear engineeringOptoelectronicsEngineeringNanotechnologyThermodynamicsPhysicsHeat Transfer and Optimization3D IC and TSV technologiesSilicon Carbide Semiconductor Technologies