The impact of thickness-related grain boundary migration on hole concentration and mobility of p-type transparent conducting CuI films
Ruibin Xue, Gang Gao, Lei Yang, Liangge Xu, Yumin Zhang, Jiaqi Zhu
Abstract
. This work deepens the understanding of hole transport such as hole concentration and mobility modulation in CuI films, highlighting the importance of controlling grain boundary migration during the film growth process.
Topics & Concepts
Grain boundaryMaterials scienceBoundary (topology)Composite materialMathematicsMathematical analysisMicrostructureCopper-based nanomaterials and applicationsZnO doping and propertiesCopper Interconnects and Reliability