Interconnected network of Ag and Cu in bioplastics for ultrahigh electromagnetic interference shielding efficiency with high thermal conductivity
Dohoon Kim, Young Jin Lee, Kyung Hyun Ahn
Topics & Concepts
Materials sciencePolylactic acidCopperCompression moldingElectromagnetic shieldingNanocompositeComposite materialElectrical conductorLayer (electronics)Thermal conductivityPlating (geology)PolymerMetallurgyGeologyGeophysicsMoldElectromagnetic wave absorption materialsTribology and Wear AnalysisAluminum Alloys Composites Properties