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Advances in machine learning and deep learning applications towards wafer map defect recognition and classification: a review

Tongwha Kim, Kamran Behdinan

2022Journal of Intelligent Manufacturing124 citationsDOI

Topics & Concepts

Artificial intelligenceDeep learningComputer scienceMachine learningConvolutional neural networkScalabilityData pre-processingArtificial neural networkPreprocessorFeature extractionEngineeringPattern recognition (psychology)DatabaseIndustrial Vision Systems and Defect DetectionIntegrated Circuits and Semiconductor Failure AnalysisAdvancements in Photolithography Techniques
Advances in machine learning and deep learning applications towards wafer map defect recognition and classification: a review | Litcius