Copper matrix thermal conductive composites with low thermal expansion for electronic packaging
Shuai Gao, Zongliang Nan, Yi Li, Nan Zhao, Qinqin Liu, Guifang Xu, Xiaonong Cheng, Juan Yang
Topics & Concepts
Materials scienceThermal expansionThermal conductivityComposite materialHot pressingComposite numberSinteringElectronic packagingMicrostructureElectrical conductorCopperThermalPressingMetallurgyPhysicsMeteorologyThermal Expansion and Ionic ConductivityThermal properties of materialsMagnesium Oxide Properties and Applications