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Study of springback behavior on U-bending part using die shoulder patterning method (DSPM)

N. J. Baharuddin, A. R. A. Manaf, Ahmad Shahir Jamaludin

2023AIP conference proceedings20 citationsDOI

Topics & Concepts

BendingDie (integrated circuit)Computer scienceMaterials scienceStructural engineeringMechanical engineeringComposite materialEngineeringMetal Forming Simulation TechniquesMetallurgy and Material FormingLaser and Thermal Forming Techniques
Study of springback behavior on U-bending part using die shoulder patterning method (DSPM) | Litcius