Litcius/Paper detail

Extremely thin interlayer of multi-element intermetallic compound between Sn-based solders and FeCoNiMn high-entropy alloy

Yu-An Shen, Sheng-Wen Chen, Haozhe Chen, Chun-Ming Chang, Yu-Hong Ouyang

2021Applied Surface Science42 citationsDOI

Topics & Concepts

IntermetallicMaterials scienceAlloySolderingDissolutionMetallurgyTinLattice constantComposite materialDiffractionChemical engineeringPhysicsEngineeringOpticsHigh Entropy Alloys StudiesHigh-Temperature Coating BehaviorsAdvanced materials and composites