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Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints

Tiam Foo Chen, Kim S. Siow

2021Journal of Alloys and Compounds236 citationsDOI

Topics & Concepts

SinteringMaterials scienceMicroelectronicsCopperJoint (building)MetallurgyThermalComposite materialNanotechnologyMeteorologyArchitectural engineeringPhysicsEngineeringElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties
Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints | Litcius