Hierarchical curing mechanism in epoxy/bismaleimide composites: Enhancing mechanical properties without compromising thermal stabilities
Hongke Peng, Yuechuan Wang, Yingqing Zhan, Fan Lei, Pan Wang, Kui Li, Ying Li, Xulin Yang
Topics & Concepts
EpoxyComposite materialMaterials scienceCuring (chemistry)ThermalThermal stabilityChemical engineeringPhysicsEngineeringMeteorologyEpoxy Resin Curing ProcessesSynthesis and properties of polymersPolymer composites and self-healing