Molybdenum copper based ultrathin two-phase heat transport system for high power-density gallium nitride chips
Cheng Fang, Feiyu Zheng, B. Chu, Weizheng Cheng, Huaixin Guo, Huanbei Chen, Ruize Wang, Chengyi Song, Peng Tao, Wen Shang, Benwei Fu, Tao Deng
Topics & Concepts
Materials scienceThermal conductivityThermal expansionComposite numberComposite materialWeldingJunction temperaturePower densityOptoelectronicsThermalPower (physics)MeteorologyPhysicsQuantum mechanicsThermal properties of materialsElectronic Packaging and Soldering TechnologiesHeat Transfer and Optimization