Vacuum diffusion bonding of TC4 titanium alloy to T2 copper with VCrNi1.8 eutectic medium entropy alloy interlayer
Baosheng Wu, Peng Li, Yueting Ma, Chao Li, Libing Huang, Liangliang Zhang, Jiachen Li, Honggang Dong
Topics & Concepts
Materials scienceEutectic systemAlloyCopperTitanium alloyMetallurgyEutectic bondingTitaniumIntermetallics and Advanced Alloy PropertiesHigh Entropy Alloys StudiesHigh-Temperature Coating Behaviors