Magnetron sputtering preparation of Cu6Sn5 preferred-orientation coating and its influence on wettability of Sn-based lead-free solder
Zhihang Zhang, Zhen Yang, Jiawei Qu, Yajia Liu, Jihua Huang, Shuhai Chen, Zheng Ye, Jian Yang
Topics & Concepts
WettingSolderingMaterials scienceCoatingSubstrate (aquarium)Composite materialSputter depositionSputteringMetallurgyContact angleThin filmNanotechnologyGeologyOceanographyElectronic Packaging and Soldering TechnologiesCopper Interconnects and Reliability3D IC and TSV technologies