High‐Throughput Fabrication of Large‐Scale Metaholograms via One‐step Printing
Chanwoong Park, Wonjoong Kim, Yeseul Kim, Hansang Sung, Jaein Park, Hyoin Song, Joohoon Kim, Dong Kyo Oh, Hyunjung Kang, Nara Jeon, Junsuk Rho, Heon Lee
Abstract
Abstract Metasurfaces, which are designed by arranging meta‐atoms, have attracted attention for their ability to create optical properties that do not exist in nature. However, previous methods for fabricating metasurfaces using electron‐beam lithography (EBL) are expensive and have limited production capacity, inhibiting mass production. In this study, a new manufacturing method is demonstrated using an argon fluoride (ArF) scanner and nanoimprint lithography (NIL) to overcome these limitations. 266 millimeter‐scale metasurfaces are designed and fabricated on an 8‐inch wafer using an ArF scanner. Subsequently, this is used as a master stamp to replicate the metasurfaces in an 8‐inch wafer scale through the NIL process all at once. To demonstrate the effectiveness of this method, a metahologram is designed and manufactured using TiO 2 nanoparticle‐embedded‐resin (nano‐PER). The metahologram achieves an 81.2% yield during replication, with a maximum efficiency of 60.7% at 450 nm, 45.1% at 532 nm, and 38.5% at 635 nm, respectively. The results demonstrate the production of practical metaholograms using low‐cost and high‐throughput processes.