Litcius/Paper detail

Excellent thermal resistance and mechanical properties polyimide resin with dual crosslinking network structure for thermal oxidation aging

Ke‐Ke Yang, Haichao Meng, Hang Ye, Long Ni, Chen Qiu, Cuiqing Zhou, Yinfu Luo, Liwei Yan, Mei Liang, Huawei Zou

2025European Polymer Journal7 citationsDOI

Topics & Concepts

Materials sciencePolyimideCompressive strengthComposite materialThermosetting polymerPhthalic anhydrideModulusThermal decompositionMolding (decorative)Glass transitionCompression moldingPolymerThermal resistanceUltimate tensile strengthFlexural strengthChemical resistanceThermal oxidationYoung's modulusBond strengthInterpenetrating polymer networkHeat resistanceThermalDynamic mechanical analysisCuring (chemistry)Elastic modulusThermal insulationSynthesis and properties of polymersEpoxy Resin Curing ProcessesPolymer composites and self-healing