Litcius/Paper detail

Tensile, hardness and microstructural properties of Sn-Pb solder alloys

Olayide R. Adetunji, Ridwan A. Ashimolowo, P. O. Aiyedun, Olanrewaju M. Adesusi, Hezekiah O. Adeyemi, Olamilekan R. Oloyede

2020Materials Today Proceedings32 citationsDOI

Topics & Concepts

Materials scienceUltimate tensile strengthMetallurgyAlloySolderingDuctility (Earth science)Crucible (geodemography)Composite materialCreepComputational chemistryChemistryElectronic Packaging and Soldering TechnologiesAdvanced Welding Techniques Analysis3D IC and TSV technologies