Compliant thermal interface materials via introducing pendent chains into polymer networks for chip cooling
Yongdong Wu, Chenxu Zhang, Wendian Tu, Guoping Du, Xiaoliang Zeng, Rong Sun, Yonglun Xu, Linlin Ren
Topics & Concepts
Thermal conductivityMaterials scienceThermal greaseFabricationThermalDecoupling (probability)Interface (matter)PolymerWork (physics)Composite materialNanotechnologyMechanical engineeringThermodynamicsEngineeringPhysicsMedicineCapillary numberControl engineeringPathologyCapillary actionAlternative medicineThermal properties of materialsAdvanced Thermoelectric Materials and DevicesDielectric materials and actuators