Thermal management of data centers: Chip-scale cooling using novel distributed inlet–outlet jet impingement liquid cold plate
Sangram Kumar Samal, Ho Chang, Yogesh Fulpagare, Chi‐Chuan Wang
Topics & Concepts
InletJet (fluid)Scale (ratio)Thermal management of electronic devices and systemsMaterials scienceChipThermalComputer coolingMechanical engineeringEnvironmental scienceMechanicsAerospace engineeringEngineeringMeteorologyPhysicsElectrical engineeringQuantum mechanicsHeat Transfer MechanismsHeat Transfer and OptimizationNanofluid Flow and Heat Transfer