Unraveling the complex oxidation effect in sintered Cu nanoparticle interconnects during high temperature aging
Yang Zuo, Ana Robador, M Wickham, S.H. Mannan
Topics & Concepts
Materials scienceMicrostructureSinteringGrain boundaryBrittlenessVoid (composites)NanoparticleHigh-temperature corrosionMetallurgyInterconnectionCorrosionComposite materialChemical engineeringNanotechnologyEngineeringComputer scienceComputer networkElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesCopper Interconnects and Reliability