Mechanics analysis of ultra-thin chip peeling from substrate under multi-needle-ejecting and vacuum-absorbing
Siyu Chen, Wenhan Lyu, Gang Wang, Ying Chen, Yinji Ma, Xue Feng
Topics & Concepts
Materials scienceSubstrate (aquarium)Composite materialChipOptoelectronicsNanotechnologyEngineeringElectrical engineeringGeologyOceanographyAdvanced Surface Polishing TechniquesNanofabrication and Lithography TechniquesAdvanced Sensor and Energy Harvesting Materials