Vertically Aligned Silicon Carbide Nanowires/Boron Nitride Cellulose Aerogel Networks Enhanced Thermal Conductivity and Electromagnetic Absorbing of Epoxy Composites
Duo Pan, Gui Yang, Hala M. Abo‐Dief, Jingwen Dong, Fengmei Su, Chuntai Liu, Yifan Li, Ben Bin Xu, Vignesh Murugadoss, Nithesh Naik, Salah M. El‐Bahy, Zeinhom M. El‐Bahy, Minan Huang, Zhanhu Guo
Abstract
Abstract With the innovation of microelectronics technology, the heat dissipation problem inside the device will face a severe test. In this work, cellulose aerogel (CA) with highly enhanced thermal conductivity (TC) in vertical planes was successfully obtained by constructing a vertically aligned silicon carbide nanowires (SiC NWs)/boron nitride (BN) network via the ice template-assisted strategy. The unique network structure of SiC NWs connected to BN ensures that the TC of the composite in the vertical direction reaches 2.21 W m −1 K −1 at a low hybrid filler loading of 16.69 wt%, which was increased by 890% compared to pure epoxy (EP). In addition, relying on unique porous network structure of CA, EP-based composite also showed higher TC than other comparative samples in the horizontal direction. Meanwhile, the composite exhibits good electrically insulating with a volume electrical resistivity about 2.35 × 10 11 Ω cm and displays excellent electromagnetic wave absorption performance with a minimum reflection loss of − 21.5 dB and a wide effective absorption bandwidth (< − 10 dB) from 8.8 to 11.6 GHz. Therefore, this work provides a new strategy for manufacturing polymer-based composites with excellent multifunctional performances in microelectronic packaging applications.