Soft electronic vias and interconnects through rapid three-dimensional assembly of liquid metal microdroplets
Dong Hae Ho, Chenming Hu, Ling Li, Michael D. Bartlett
Topics & Concepts
Materials scienceLiquid metalMetalOptoelectronicsNanotechnologyComposite materialMetallurgyAdvanced Sensor and Energy Harvesting MaterialsModular Robots and Swarm IntelligenceNanomaterials and Printing Technologies