Litcius/Paper detail

A grinding force model in two-dimensional ultrasonic-assisted grinding of silicon carbide

Hongbo Li, Tao Chen, Zhenyan Duan, Yiwen Zhang, Haotian Li

2022Journal of Materials Processing Technology66 citationsDOI

Topics & Concepts

GrindingMaterials scienceMachiningBrittlenessSilicon carbideMechanical engineeringUltrasonic sensorComposite materialMetallurgyAcousticsEngineeringPhysicsAdvanced machining processes and optimizationAdvanced Surface Polishing TechniquesAdvanced Machining and Optimization Techniques
A grinding force model in two-dimensional ultrasonic-assisted grinding of silicon carbide | Litcius