Effects of Bi Addition on the Solderability and Mechanical Properties of Sn-Zn-Cu Lead-Free Solder
Cunji Pu, Jialong Qiu, Caiju Li, Peng Gao, Yanzhi Peng, Qi He, Hailong Bai, Jianhong Yi
Topics & Concepts
SolderabilitySolderingMaterials scienceIntermetallicMetallurgyDuctility (Earth science)Ultimate tensile strengthMicrostructureAlloyBrittlenessComposite materialCreepElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites Properties3D IC and TSV technologies