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A new interface bonding improvement method combined with precipitation and hot-pressing process to ameliorate the defects of para aramid paper

Ping Xie, Na Li, Kairong Zhao, Yutong Cao, Junrong Yu, Yan Wang, Zuming Hu

2024Composites Part A Applied Science and Manufacturing19 citationsDOI

Topics & Concepts

Materials scienceAramidUltimate tensile strengthComposite materialBonding strengthPressingGlass transitionHot pressingCopolymerBond strengthPolymerFiberLayer (electronics)AdhesiveFiber-reinforced polymer compositesAdvanced Cellulose Research StudiesNatural Fiber Reinforced Composites
A new interface bonding improvement method combined with precipitation and hot-pressing process to ameliorate the defects of para aramid paper | Litcius