Reduction Behavior of Surface Oxide on Submicron Copper Particles for Pressureless Sintering Under Reducing Atmosphere
T. Matsuda, Daiki Yamagiwa, Hideki Furusawa, K. Sato, Hisashi Yashiro, Keigo Nagao, Jungeun Kim, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose
Topics & Concepts
SinteringCopperAtmosphere (unit)Solid-state physicsReduction (mathematics)Materials scienceMetallurgyOxideReducing atmosphereCopper oxideComposite materialCondensed matter physicsPhysicsGeometryMeteorologyMathematicsElectronic Packaging and Soldering TechnologiesAdvanced materials and compositesInjection Molding Process and Properties