Failure analysis from microcracks to a dominant crack in MEMS thin films using combined damage and fracture mechanics
Jiaxing Cheng, Guangyu Li, Hui Shen, Longchao Dai
Topics & Concepts
Materials scienceFracture mechanicsMicroelectromechanical systemsStructural engineeringDamage mechanicsStress (linguistics)Material failure theoryFracture (geology)Constitutive equationCharacterization (materials science)Composite materialReliability (semiconductor)MechanicsFinite element methodEngineeringNanotechnologyPhysicsQuantum mechanicsPower (physics)PhilosophyLinguisticsAdvanced Surface Polishing TechniquesAdvanced MEMS and NEMS TechnologiesAdhesion, Friction, and Surface Interactions