Morphological characterization and mechanical behavior by dicing and thinning on direct bonded Si wafer
Fumihiro Inoue, Arnita Podpod, Lan Peng, Alain Phommahaxay, Kenneth June Rebibis, Akira Uedono, Eric Beyne
Topics & Concepts
Wafer dicingWaferMaterials scienceWafer bondingAnodic bondingBreakageSurface finishComposite materialThinningDie preparationDie (integrated circuit)OptoelectronicsNanotechnologyEcologyBiology3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesAdvanced Surface Polishing Techniques