Litcius/Paper detail

Fabrication of flexible copper patterns by electroless plating with copper nanoparticles as seeds

Yabing Zhang, Teng Zhang, Hongbin Shi, Qing Liu, Tao Wang

2021Applied Surface Science39 citationsDOI

Topics & Concepts

CopperPolyethylene terephthalateCopper platingMaterials scienceSheet resistanceNanoparticleSubstrate (aquarium)Electrical conductorAdhesionPlating (geology)FabricationMetallurgyChemical engineeringDeposition (geology)FormaldehydeComposite materialNanotechnologyChemistryLayer (electronics)Organic chemistryElectroplatingBiologyPathologySedimentAlternative medicineGeophysicsPaleontologyOceanographyGeologyEngineeringMedicineNanomaterials and Printing TechnologiesAdvanced Sensor and Energy Harvesting MaterialsNanofabrication and Lithography Techniques
Fabrication of flexible copper patterns by electroless plating with copper nanoparticles as seeds | Litcius