Bonding strength enhancement of low temperature sintered SiC power module by femtosecond laser induced micro/nanostructures
Peilin Cao, Cong Wang, Nai Lin, Shaohui Li, Xiaofeng Zhang, Ji’an Duan
Topics & Concepts
Materials scienceMicroelectronicsComposite materialFemtosecondSinteringShear strength (soil)LaserThermal shockSubstrate (aquarium)Laser power scalingOptoelectronicsOpticsOceanographySoil scienceGeologyEnvironmental sciencePhysicsSoil waterMetal and Thin Film MechanicsElectronic Packaging and Soldering Technologies3D IC and TSV technologies