Diffusion bonding at the interface of Bi2Te3 thermoelectric modules
Yen Ngoc Nguyen, Injoon Son
Topics & Concepts
Materials scienceSolderingIntermetallicElectrodeMetallurgyLayer (electronics)CoatingDiffusion barrierPalladiumThermoelectric effectNickelComposite materialAlloyChemistryBiochemistryPhysicsThermodynamicsPhysical chemistryCatalysisElectronic Packaging and Soldering TechnologiesAdvanced Thermoelectric Materials and DevicesIntermetallics and Advanced Alloy Properties