Properties of phenolic adhesives formulated with activated organosolv lignin derived from cornstalk
Shanghuan Feng, Tao Shui, Haoyu Wang, Xianbin Ai, Takashi Kuboki, Chunbao Xu
Topics & Concepts
OrganosolvLigninAdhesiveSodium hydroxideFormaldehydeCuring (chemistry)PhenolChemistryAqueous solutionMaterials scienceComposite materialNuclear chemistryOrganic chemistryLayer (electronics)Lignin and Wood ChemistryWood Treatment and PropertiesAdvanced Cellulose Research Studies