Exploring three-point-bending fracture toughness of thick diamond films from different directions
Kang An, Peng Liu, Siwu Shao, Haixia Li, Zhiliang Yang, Shuai Zhang, Shiyu Li, Yabo Huang, Jinlong Liu, Liangxian Chen, Junjun Wei, Yuting Zheng, Qing Liu, Fengbin Liu, Chengming Li
Topics & Concepts
Materials scienceFracture toughnessComposite materialDiamondNucleationToughnessGrain sizeEnhanced Data Rates for GSM EvolutionOrganic chemistryTelecommunicationsComputer scienceChemistryDiamond and Carbon-based Materials ResearchMetal and Thin Film MechanicsAdvanced Surface Polishing Techniques