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Electrocaloric cooling over high device temperature span

Yuan Meng, Jun‐Hong Pu, Qibing Pei

2021Joule70 citationsDOIOpen Access PDF

Topics & Concepts

Span (engineering)Materials scienceEngineeringMechanical engineeringNuclear engineeringEngineering physicsStructural engineeringFerroelectric and Piezoelectric MaterialsMagnetic and transport properties of perovskites and related materialsMultiferroics and related materials
Electrocaloric cooling over high device temperature span | Litcius