A combined solution of thermoelectric coolers and microchannels for multi-chip heat dissipation with precise temperature uniformity control
Bo Cong, Yanmei Kong, Yuxin Ye, Ruiwen Liu, Xiangbin Du, Lihang Yu, Shiqi Jia, Zhiguo Qu, Binbin Jiao
Topics & Concepts
Thermoelectric coolingMaterials scienceHeat sinkTemperature controlThermal resistanceMicrochannelChipHeat fluxTECThermoelectric effectOptoelectronicsThermalMechanicsThermodynamicsMechanical engineeringHeat transferElectrical engineeringEngineeringPhysicsNanotechnologyAstronomyIonosphereAdvanced Thermoelectric Materials and DevicesHeat Transfer and OptimizationThermal properties of materials