Highly thermoconductive and mechanically robust boron nitride/aramid composite dielectric films from non-covalent interfacial engineering
Junwen Ren, Guoqing Jiang, Zi Wang, Qiu-Wanyu Qing, Fuli Teng, Zirui Jia, Guanglei Wu, Shenli Jia
Topics & Concepts
Materials scienceBoron nitrideAramidSurface modificationComposite materialComposite numberDielectricUltimate tensile strengthPolymerNanotechnologyChemical engineeringFiberOptoelectronicsEngineeringThermal properties of materialsDielectric materials and actuatorsGraphene research and applications