Microstructure, mechanical, and thermal behaviors of SnBi/Cu solder joint enhanced by porous Cu

Yang Liu, Boqiao Ren, Min Zhou, Xianghua Zeng, Fenglian Sun

2020Journal of Materials Science Materials in Electronics31 citationsDOI

Topics & Concepts

SolderingMaterials sciencePorosityMicrostructureThermal conductivityComposite materialShear strength (soil)Joint (building)MetallurgyCopperSoil waterEngineeringArchitectural engineeringEnvironmental scienceSoil scienceElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites Properties3D IC and TSV technologies