Effect of temperature cycling on the leakage mechanism of TSV liner
Si Chen, Xiaodong Jian, Kai Li, Guoyuan Li, Zhizhe Wang, Xiaofeng Yang, Zhiwei Fu, Hongyue Wang
Topics & Concepts
Materials scienceMicrostructureComposite materialTemperature cyclingCrackingPenetration (warfare)Leakage (economics)Degradation (telecommunications)Failure mechanismMetallurgyElectronic engineeringEconomicsMeteorologyEngineeringMacroeconomicsPhysicsOperations researchThermal3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesSemiconductor materials and devices