Litcius/Paper detail

Interfacial bonding and microstructural evolution in Inconel-copper bimetallic structures fabricated by directed energy deposition-arc

Kun Liu, Zhaoyang Yan, Rui Pan, Xiaowei Wang, Fude Wang, Shujun Chen

2024Materials Science and Engineering A26 citationsDOI

Topics & Concepts

InconelBimetallic stripCopperMaterials scienceMetallurgyDeposition (geology)Arc (geometry)Accumulative roll bondingComposite materialMicrostructureAlloyMechanical engineeringGeologyMetalEngineeringPaleontologySedimentAdditive Manufacturing Materials and ProcessesHigh Entropy Alloys StudiesIntermetallics and Advanced Alloy Properties