Enhancing high-temperature tensile properties of Ni/Ni-W laminated composites for MEMS devices
Zhe‐Xuan Wang, Fei Liang, Guangping Zhang, Bin Zhang
Topics & Concepts
Materials scienceUltimate tensile strengthComposite materialMicrostructureThermal stabilityComposite numberPlasticityElongationPhysicsQuantum mechanicsShape Memory Alloy TransformationsElectronic Packaging and Soldering TechnologiesMetallic Glasses and Amorphous Alloys