Microscopic removal mechanism of 4 H-SiC during abrasive scratching in aqueous H2O2 and H2O: Insights from ReaxFF molecular dynamics
Xinxing Ban, Shaodong Zheng, Zhuangzhi Tian, Jianhui Zhu, Wenlan Ba, Ningchang Wang, Shaoxing Han, Hui Qiu, Xing Wang, Zhengxin Li
Topics & Concepts
ReaxFFScratchingMolecular dynamicsAqueous solutionAbrasiveMaterials scienceMechanism (biology)TribologyChemical engineeringDynamics (music)ChemistryComposite materialNanotechnologyComputational chemistryPhysical chemistryEngineeringEpistemologyAcousticsPhysicsPhilosophyInteratomic potentialAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchMetal and Thin Film Mechanics