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Decoupling Seebeck coefficient and resistivity, and simultaneously optimizing thermoelectric and mechanical performances for n-type BiTeSe alloy by multi-pass equal channel angular extrusion

Xiaoming Hu, Xi’an Fan, Bo Feng, Dong Kong, Peihai Liu, Chenhui Xu, Zhixiang Kuang, Guangqiang Li, Yawei Li

2020Materials Science and Engineering B12 citationsDOI

Topics & Concepts

IngotMaterials scienceEqual channel angular extrusionMicrostructureThermoelectric effectExtrusionSeebeck coefficientThermoelectric materialsElectrical resistivity and conductivityGrain sizeMetallurgyAlloyCeramicFigure of meritComposite materialDimensionless quantityDecoupling (probability)Thermal conductivityOptoelectronicsElectrical engineeringMechanicsControl engineeringPhysicsEngineeringThermodynamicsAdvanced Thermoelectric Materials and DevicesChalcogenide Semiconductor Thin FilmsHeusler alloys: electronic and magnetic properties
Decoupling Seebeck coefficient and resistivity, and simultaneously optimizing thermoelectric and mechanical performances for n-type BiTeSe alloy by multi-pass equal channel angular extrusion | Litcius